High TG FR-4 PCB for Automotive and Industrial High Temperature Environments

Key Attributes
Brand Name: Jiaqing Circuit
Place of Origin: China
Certification: ISO9001
Price: negotiate
Delivery Time: 15-30 Days
Payment Terms: L/C,D/A,D/P,T/T

Product Summary

High TG (Glass Transition Temperature) FR-4 PCB is engineered for applications requiring extended thermal performance beyond standard FR-4 capabilities. With a TG of 150°C to 170°C, this board maintains dimensional stability and mechanical integrity under elevated temperatures, making it ideal for ...

Product Custom Attributes

Layer Count:
1 – 10 Layers
Surface Finish Options:
HASL, ENIG, OSP, Immersion Tin, Immersion Silver
Operating Temperature:
-20°C To +130°C
Thermal Conductivity:
Enhanced Via Copper Mass
Product Description

High TG (Glass Transition Temperature) FR-4 PCB is engineered for applications requiring extended thermal performance beyond standard FR-4 capabilities. With a TG of 150°C to 170°C, this board maintains dimensional stability and mechanical integrity under elevated temperatures, making it ideal for automotive under-hood systems, industrial power electronics, and LED lighting. The enhanced thermal reliability reduces the risk of delamination, pad lifting, and via cracking during assembly and operation. Compatible with lead-free soldering processes (up to 260°C peak reflow), this board meets the demands of modern high-temperature electronics assembly.

Applications & Advantages by Category
  • Automotive Under-Hood Systems – Engine control units (ECUs), transmission controllers, and sensor modules operate reliably in high-temperature engine compartments.
  • Industrial Power Electronics – Motor drives, inverters, and power supplies benefit from the board’s ability to handle elevated operating temperatures.
  • LED Lighting Systems – High-power LED drivers and control boards maintain performance in high-ambient-temperature lighting environments.
  • Telecommunications Equipment – Base station power amplifiers and high-power RF modules leverage the thermal stability of High TG materials.
  • Lead-Free Manufacturing – The board’s high TG ensures reliable performance through lead-free reflow soldering processes (peak 260°C), preventing delamination and pad lifting.
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