Metal Edge Plated PCB

Metal Edge Plated PCB is a PCB with metallized copper plating along its cut profile edges. Its side‑edge conductors are electrically connected to surface copper foils to form complete side‑wall conductive barriers. Different from standard PCBs which only metallize top/bottom surfaces and through‑holes and leave bare substrate on board edges. It is widely applied for high‑current transmission, EMI shielding, grounding & heat dissipation, RF signal processing and connector contact applications.

Key Process Features

• Complete side‑wall copper layer: Copper is plated on profile side walls and reliably bonded to surface copper to achieve edge‑side conductivity. Gold or nickel plating surface finishes are available to improve wear resistance, anti‑oxidation and contact performance.
• Manufacturing methods: Dominant processes include depth‑controlled routing plus electroplating, and edge electroplating after profile routing. V‑cut followed by edge plating is an alternative option, subject to board thickness and outline tolerance, with constraints on minimum processable edge width.
• Dimensional constraints: Edge‑plated areas shall keep sufficient clearance from component pads. There are manufacturing limits for board thickness, minimum plating width and corner radius. Sharp corners must be rounded to prevent cracking and peeling of electroplated copper.

Main Advantages

✅ High‑current capacity: Side‑wall copper increases conductive cross‑section, ideal for high‑current power PCBs to shunt current and reduce impedance.

✅ Superior grounding & EMI shielding: Continuous grounding metal side‑walls enable direct contact grounding with enclosures and suppress electromagnetic interference, widely used for high‑frequency RF modules.

✅ Enhanced heat dissipation: Side‑wall metal assists heat transfer and improves overall PCB thermal diffusion.

✅ Mechanical contact conduction: Direct electrical connection via board edges with springs and connectors, eliminating extra connectors and simplifying mechanical structures.