High Thermal Conductivity Aluminum-Based PCB This high thermal conductivity aluminum-based PCB (Metal Core PCB / MCPCB) features an advanced thermally conductive dielectric layer achieving 3.0 W/m·K thermal conductivity – ten times that of standard FR-4 material (0.3 W/m·K). The exceptional heat ...
High Thermal Conductivity Aluminum-Based PCB
This high thermal conductivity aluminum-based PCB (Metal Core PCB / MCPCB) features an advanced thermally conductive dielectric layer achieving 3.0 W/m·K thermal conductivity – ten times that of standard FR-4 material (0.3 W/m·K). The exceptional heat transfer capability efficiently removes heat from power components, significantly lowering junction temperatures and extending device lifespan under continuous high-load operation. Constructed with a 5052 aluminum base, a dielectric layer formulated with ceramic-filled specialty polymers, and a copper circuit layer (1-3 oz), this single-sided board delivers superior thermal performance, high dielectric strength (up to 4kV), and excellent mechanical stability for demanding power electronics applications.
| Parameter | Specification |
|---|---|
| Base Metal | Aluminum (Al), 5052 series |
| Thermal Conductivity (Dielectric) | 3.0 W/m·K |
| Thermal Impedance (75µm dielectric) | 0.040 °C·in²/W |
| Dielectric Thickness | 50μm – 150μm (customizable) |
| Copper Circuit Weight | 1oz – 3oz (35μm – 105μm) |
| Withstand Voltage | ≥2,000V – 4,000V |
| Flame Rating | UL94 V-0 |
| Operating Temperature | -40°C to +140°C |
| Dielectric Material | Ceramic-filled polymer (AlN, Al₂O₃, BN) |
| Surface Finish Options | HASL (lead-free), ENIG, OSP, Immersion Silver |
| Solder Mask Color | White, Black, Green (customizable) |
| Applicable Standards | IPC-6012, IPC-A-600, RoHS compliant |
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