High Speed Signal Integrity Rigid-Flex PCB with Controlled Impedance for 5G and Data Communication

Key Attributes
Brand Name: Jiaqing Circuit
Place of Origin: China
Certification: ISO9001
Price: negotiate
Delivery Time: 15-30 Days
Payment Terms: L/C,D/A,D/P,T/T

Product Summary

This high-speed rigid-flex PCB is engineered for telecommunications and data communication applications requiring superior signal integrity at high frequencies. The hybrid construction integrates low-loss polyimide flex sections with advanced rigid materials (including Rogers and PTFE laminates) to ...

Product Custom Attributes

Layer Configuration:
4 – 12 Layers
Surface Finish Options:
ENEPIG, Hard Gold (30-50µin), ENIG
Flex Material:
Polyimide (PI / Kapton) With RA Copper
Rigid Material:
High-Tg FR-4, Medical-grade PI Laminates
Operating Temperature:
-40°C To +125°C
Product Description

This high-speed rigid-flex PCB is engineered for telecommunications and data communication applications requiring superior signal integrity at high frequencies. The hybrid construction integrates low-loss polyimide flex sections with advanced rigid materials (including Rogers and PTFE laminates) to maintain signal quality across rigid-to-flex transitions. With tight controlled impedance tolerance (±5%), insertion loss and return loss optimized for high-speed interfaces up to 100Gbps, and surface finishes including immersion silver and ENIG, this rigid-flex PCB is the ideal solution for 5G base stations, optical transceivers, and high-speed data communication equipment.

Applications & Key Advantages by Category
  • 5G Base Stations & Antenna Systems – Massive MIMO antenna modules and baseband processing units benefit from the stable dielectric properties and controlled impedance (±5%) that maintain signal integrity at millimeter-wave frequencies. The rigid-flex construction enables compact stacking of RF front-end modules.
  • Optical Transceivers & Fiber Optic Equipment – High-speed optical modules leverage the low-loss flex sections to maintain signal quality in compact form factors. The rigid sections provide stable mounting for laser drivers and TIA/limiting amplifiers while the flex section connects to the optical subassembly.
  • High-Speed Routers & Switches – Data center networking equipment utilizes controlled impedance for differential pairs (100Ω/90Ω) and single-ended traces (50Ω). The connector-free rigid-flex construction reduces signal path discontinuities compared to traditional backplane+connector architectures.
  • Test & Measurement Equipment – High-frequency test instruments benefit from the stable dielectric properties and consistent impedance through the flex section, ensuring accurate measurement results. The low insertion loss preserves signal fidelity in wide-bandwidth applications.
  • Microwave & Millimeter-Wave Applications – Tight impedance control and low-loss materials support frequencies up to 100GHz with minimized reflection and attenuation, enabling reliable performance in the most demanding high-frequency communication systems.
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