This ultra-thin rigid-flex PCB is specifically engineered for consumer electronics and IoT devices where space, weight, and form factor are critical constraints. With a total profile as thin as 0.3mm and flexible sections that can fold into 3D configurations, this board enables the miniaturization ...
This ultra-thin rigid-flex PCB is specifically engineered for consumer electronics and IoT devices where space, weight, and form factor are critical constraints. With a total profile as thin as 0.3mm and flexible sections that can fold into 3D configurations, this board enables the miniaturization of smartwatches, fitness trackers, hearables, and compact IoT sensors. The construction features a 25µm polyimide core with adhesiveless construction, supporting 90° to 180° bending with minimum bend radius of 0.5mm for static applications. Manufactured to IPC-6013 Class 2 standards with ENIG or ENEPIG surface finishes, this rigid-flex PCB delivers the high-density interconnect required for sensors, microcontrollers, and wireless transceivers in the most compact device enclosures.
Smartwatches & Fitness Trackers – The ultra-thin 0.3mm total profile enables comfortable, lightweight wearable devices that can be worn continuously. The rigid sections provide stable mounting for processors and display drivers, while the flex sections fold around the curved wristband geometry.
Hearables & Wireless Earbuds – Miniaturized assemblies for wireless earbuds and audio devices benefit from the compact 3D packaging that fits multiple PCBs into extremely small housings. The high-density interconnect supports Bluetooth SoCs, MEMS microphones, and battery management in a single unified structure.
IoT Sensor Nodes – Environmental sensors, motion detectors, and smart home devices benefit from the connector-free construction that reduces size and improves reliability in always-on applications. The low-profile design enables integration into thin product enclosures where traditional PCBs cannot fit.
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