Ultra Low Loss 10 Layer 400G Optical Module PCB RO5880 High Frequency High Speed Signal Integrity

Key Attributes

Brand Name: Jiaqing Circuit

Place of Origin: China

Certification: ISO9001

Price: negotiate

Delivery Time: 15-30 Days

Payment Terms: L/C,D/A,D/P,T/T

Product Summary

The 400G optical module PCB is a high-frequency, high-speed printed circuit board specifically engineered for next-generation optical transceivers operating at 400Gbps data rates. Manufactured using advanced low-loss materials such as RO5880 high-frequency microwave laminate, MEGTRON 6, or hybrid ...

Product Custom Attributes

Copper Weight (Outer Layers):

3oz – 20oz (105μm – 700μm)

Copper Weight (Inner Layers):

1oz – 20oz (stackable To 200oz)

Current Capacity:

>100A (design Dependent)

Surface Finish :

ENIG, HASL (lead-free), OSP, Immersion Tin

Material Options:

Rogers (4000/3000 Series), PTFE, Arlon, Nelco, Taconic

Frequency Range:

1GHz – 100GHz

Product Description

The 400G optical module PCB is a high-frequency, high-speed printed circuit board specifically engineered for next-generation optical transceivers operating at 400Gbps data rates. Manufactured using advanced low-loss materials such as RO5880 high-frequency microwave laminate, MEGTRON 6, or hybrid stacks combining IT968TC and S1000-2M, this 10-layer board delivers exceptional signal integrity with minimized insertion loss and stable dielectric properties at high frequencies. Featuring HDI technology with laser-drilled microvias (0.10mm), fine line/space geometries down to 0.075mm/0.075mm, and tight impedance control (100±7%Ω, 50±10%), the 400G optical module PCB supports PAM4 modulation schemes up to 50Gbps per lane. With partial hard gold plating up to 50μ″ for enhanced wear resistance on contact fingers and ENIG or immersion silver surface finishes, this board is the ideal substrate for QSFP-DD, OSFP, and CFP8 form factor optical transceivers deployed in hyperscale data centers, AI clusters, and 5G communication infrastructure.

Parameter	Specification
Application	400G Optical Module / Optical Transceiver
Layer Count	10 layers (up to 12 layers available)
Board Thickness	1.0 ± 0.1 mm
Material Options	RO5880 high-frequency microwave laminate, MEGTRON 6, IT968TC + S1000-2M hybrid, Rogers 3000/4000 series
Dielectric Loss (Df @10GHz)	≤0.002 – 0.0037 (material dependent)
Minimum Line Width/Space	0.075mm / 0.075mm
Minimum Laser Microvia	0.10mm
Minimum Mechanical Hole	0.15mm
Impedance Control	100 ± 7%Ω, 50 ± 10%Ω
Maximum Signal Rate	50 Gbps per lane
HDI Technology	3-step HDI with blind/buried vias, laser-drilled microvias
Surface Finish	Partial hard gold 50μ″ + ENIG / ENEPIG / Immersion Silver
Form Factor Support	QSFP-DD, OSFP, CFP8
Dielectric Constant (Dk)	3.0 – 3.48 (material dependent)

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