20 layer any layer interconnection PCB, 9 times lamination, finished board thickness 2.8mm. High-density HDI multilayer PCB with stacked microvias, suitable for high-speed signal, server and high-reliability electronic applications.
This is a 20-layer HDI PCB with any layer interconnection structure, manufactured via 9 lamination cycles, finished board thickness 2.8mm. Adopting stacked microvias technology, it realizes electrical connection between arbitrary layers, delivering ultra-high wiring density and stable high-speed signal performance.
This 20-layer any layer HDI PCB is widely used in high-speed servers, data communication equipment, high-end network switches, radar, aerospace and high-reliability industrial control systems. The any-layer stacked microvia structure greatly improves wiring density, shortens signal transmission path, reduces signal loss and crosstalk, ensuring stable high-speed signal integrity under high-frequency working conditions. It can help customers miniaturize device size while maintaining excellent electrical performance.
We support customized stack-up design, various surface finishes including ENIG, HASL, OSP, Hard Gold, Immersion Silver. Strictly produced per IPC-A-600 standards. Available for prototype, small batch and mass production.
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