High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications

Key Attributes

Brand Name: Jiaqing Circuit

Place of Origin: China

Certification: ISO9001

Price: negotiate

Delivery Time: 15-30 Days

Payment Terms: L/C,D/A,D/P,T/T

Product Summary

BT IC substrate is engineered for automotive electronics requiring AEC-Q100 Grade 2 compatibility and extended temperature cycling reliability. BT resin's high glass transition temperature (180-225°C), low CTE (12-16 ppm/°C), and ultra-low moisture absorption (0.3-0.5%) provide the thermal and ...

Product Custom Attributes

Material:

BT (Bismaleimide Triazine) Resin

Glass Transition Temperature:

180°C – 225°C (DSC)

Core Thickness:

40 – 200 μm

Line/Space Capability:

10/10 μm To 30/30 μm (SAP/MSAP)

Via Diameter:

50 – 100 μm

Layer Count:

2 – 12 Layers

Surface Finish:

ENIG, ENEPIG, OSP

Product Description

BT IC substrate is engineered for automotive electronics requiring AEC-Q100 Grade 2 compatibility and extended temperature cycling reliability. BT resin's high glass transition temperature (180-225°C), low CTE (12-16 ppm/°C), and ultra-low moisture absorption (0.3-0.5%) provide the thermal and mechanical stability demanded by under-hood control modules, radar systems, and high-temperature environments. Available in 2-12 layer configurations with line/space down to 10/10 μm and ENIG/ENEPIG surface finishes, these substrates support wire-bond BGA packages (15*15 mm to 45*45 mm, 119-1520 balls) and FC-CSP packages for automotive MCUs, radar transceivers, and sensor fusion modules.

Applications & Key Advantages by Category

Automotive MCUs & ECUs: High Tg (180-225°C) and low moisture absorption ensure reliable operation in under-hood environments with extended temperature cycling (-40°C to +125°C).
Automotive Radar & ADAS: Stable dielectric properties (Dk 3.4-4.0, Df 0.004-0.010) support 77 GHz radar transceivers and ADAS sensor fusion modules.
Power Management ICs (PMIC): Excellent thermal conductivity (0.35 W/m·K) and high decomposition temperature (≥325°C) support high-current automotive power management applications.
Wireless Connectivity (V2X, Bluetooth): BT substrates support automotive-grade wireless MCU packages (e.g., 7*7 mm VQFN48) with wettable flanks for reliable solder joint inspection.

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