BT (Bismaleimide Triazine) resin substrates, originally developed by Mitsubishi Gas Chemical, represent the dominant substrate material for semiconductor IC packaging. Over 70% of organic IC package substrates use BT-based laminate systems. This high-performance thermoset polymer combines a high ...
BT (Bismaleimide Triazine) resin substrates, originally developed by Mitsubishi Gas Chemical, represent the dominant substrate material for semiconductor IC packaging. Over 70% of organic IC package substrates use BT-based laminate systems. This high-performance thermoset polymer combines a high glass transition temperature (Tg) of 185-225°C with ultra-low moisture absorption (0.3-0.5%) and low dielectric constant (Dk 3.4-4.0 @ 1 GHz), enabling reliable signal routing between silicon die and PCB through multiple reflow cycles. Available in layer counts from 2 to 12 layers with core thicknesses of 40-200 μm and line/space capabilities down to 10/10 μm via SAP (Semi-Additive Process), BT substrates provide the dimensional stability, thermal endurance, and fine-line patterning required for memory chips, mobile application processors (AP), and RF components.
Memory Chip Packaging (DDR, NAND, eMMC)
BT substrates provide the stable organic carrier with superior heat, moisture, and dimensional behavior required for fine-pitch package routing, wire bonding, reflow exposure, and package reliability. The dimensional stability prevents thermal expansion and contraction from affecting circuit yield.
Mobile Application Processors (AP)
Widely used in smartphone AP packaging where the high Tg (185-225°C) survives multiple reflow cycles during package assembly. Over 70% of IC substrates use BT materials.
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