BT Resin PCB IC Substrate, BGA Packaging Substrate

Our BT resin IC substrate (Bismaleimide Triazine substrate) is a high-performance packaging substrate specially designed for BGA, CSP and advanced semiconductor chip packaging applications.

BT material features ultra-high Tg, excellent thermal stability, low thermal expansion coefficient and reliable dielectric performance, ideal for high-density fine pitch interconnection of semiconductor packages.

Core Advantages

✅ High Tg BT Resin substrate, Tg＞250℃, outstanding heat resistance

✅ Fine pitch fabrication capability: Min line width 3mil (0.075mm), Min spacing 2mil (0.05mm)

✅ Advanced via technology: Blind via, buried via & through-hole available, via diameter down to 50μm

✅ Multiple surface finish: ENIG, ENEPIG, OSP for different chip bonding requirements

✅ Customizable layers: 2~12 layers, core thickness from 40μm to 200μm

✅ RoHS compliant, ISO9001 certified

✅ Prototype & mass production available, small MOQ accepted

Specifications

• Material: BT Resin (Bismaleimide Triazine)
• Layer Count: 2 – 12 Layers
• Minimum Line Width: 3 mil (0.075 mm)
• Minimum Spacing: 2 mil (0.05 mm)
• Via Diameter: 50 – 100 μm
• Via Type: Blind, Buried, Through-hole
• Core Thickness: 40 – 200 μm
• Surface Finish: ENIG, ENEPIG, OSP
• Operating Temperature: -40℃ ~ 150℃
• Max Board Size: Customizable up to 600mm × 600mm
• Compliance: RoHS, ISO9001

Application

IC packaging, BGA packaging, CSP, semiconductor devices, high-density microelectronic modules.

About JQPCB

JQPCB is a professional manufacturer for high-end PCB & IC substrates. We provide one-stop service from Gerber review, prototype trial to volume mass production. Send us your Gerber files and specs for quotation.